Hussein F. Theeb, A., and I. Y. Hussain. “A Review of the Thermal Phase Change Materials (PCM) and Metal Foams for Electronic Chips Cooling”. Al-Iraqia Journal for Scientific Engineering Research, vol. 3, no. 4, Dec. 2024, pp. 1-13, doi:10.58564/IJSER.3.4.2024.274.