HUSSEIN F. THEEB, A.; Y. HUSSAIN, I. A Review of the Thermal Phase Change Materials (PCM) and Metal Foams for Electronic Chips Cooling . Al-Iraqia Journal for Scientific Engineering Research, [S. l.], v. 3, n. 4, p. 1–13, 2024. DOI: 10.58564/IJSER.3.4.2024.274. Disponível em: https://ijser.aliraqia.edu.iq/index.php/ijser/article/view/274. Acesso em: 20 apr. 2026.